Markets
Microelectronics / Semiconductor Packaging

Technica USA’s partnership with Panasonic Factory Solutions of America (PFSA) enables us to offer our customers in the microelectronics market, solutions across their entire production process. PFSA creates solutions to realize the full potential of your product designs while increasing your productivity, quality and profit.

To better service the advanced packaging needs of our customers, we are able to qualify their products on high-volume production equipment employed at PFSA’s Advanced Packaging Lab in Buffalo Grove, Illinois. The packaging lab includes all of Panasonic’s microelectronic assembly machines and the latest in metrology and test equipment including X-Ray, C-SAM, SEM and EDS for post-assembly analysis.

In addition, we provide other tools for environmental control, product handling and contact cleaning.

Backed with over 20 years of experience for providing customer service and support for manufacturers of electronic products, Technica is well positioned to meet the requirements of the microelectronics customer base. Along with our partners, we are ready to serve you.

“We invite our customers to bring their toughest microelectronic challenge to us and in return, we will supply the solution”.

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