To verify complete package performance a GaAs thru is assembled inside the package. Shown below are complete measured and modeled performance of a 2mm GaAs thru epoxy to the package bottom with 2 bond wires each side of 0.016 mm length and 0.025 mm loop height. Correlation is very good, showing we can measure, model, design and customize to 50 GHz for you specific application.
Measured(blue) and modeled Insertion Loss
Measured(blue) and modeled(red) Return Loss
Technica provides 3 standard cavity sizes for a 5x5 mm package. The data sheet not only provides specifications, but we provide single
port s-parameters for these standards and your custom design. Referenced to the package edge to a 100x100 micron pad on the MMIC with two 1 mil bond wires of
160u length and 250u loop height this is the most accurate way for you to simulate the package parasitic and the influence on your system.
Using this technique several successful designs have been made including:
20-34 GHz LNA & Mixer
17-33 GHz ¼ W Amplifier
20-34 GHz LNA & Mixer
17-33 GHz ¼ W Amplifier
Package Features
- Base and Lid, PPO Blend Resin System
- DK 3.6
- Loss Tangent 0.0025
- Finished in immersion gold/ electoless nickel/ electroless palladium
- Low thermal resistance, typically less than 0.25 oC/W from die base to package base
- Lead free and ROHS compliant
- 5510 has a 1x2.6 mm cavity size and can accommodate MMIC up to 0.9 mm in length
- 5520 has a 2x2.6 mm cavity size and can accommodate MMIC up to 1.9 mm in length
- 5510 has a 1x2.6 mm cavity size and can accommodate MMIC up to 2.9 mm in length
- Other custom cavity sizes can be designed to your specifications
- Other custom exterior sizes can be designed to your specifications
- Package can be used for singe or multi-chip solutions
- Lid sealing instructions allow full aqueous cleaning
Delivery Options
- Single packages (waffle packs or trays)
- Single packages (tape and reel)
- Arrays for assembly (partially profiled) example below
