Technica has developed an innovative low cost line of surface mount packaging to be used in DC to 50 GHz applications. The package is available in three standard sizes, or can be customized to many different configurations. Technica has extensive experience in the design, simulation and usage of high frequency packaging and is willing to help your specific application need.

At Technica, we have found that the best solution lies in the combination of a low dielectric laminate material and three dimensional high frequency pattern design. The patterning and vias allow the design of a high frequency cut-off transmission lines that maintain a near perfect 50 impedance from package edge to IC bond pad. The IC is epoxied to a solid copper slug which not only allows excellent high frequency grounding, but excellent thermal conduction and rigidity to protect the fragile IC from cracking. An air cavity is built above and around the IC to ensure the lowest dielectric medium possible. The package is available in an array that allow simple assembly, lids attach, and snap singulation. Typical exterior size is 5x5mm with 2 high frequency I/Os and 6 DC/RF pins. Several cavity size options are made to accommodate IC sizes from 0.5x2.6mm to 3x2.6mm.

Measured performance for a package of this design shows an excellent match (better than 2:1 VSWR, -10dB Return Loss) well past 50 GHz. Insertion loss (dembedded, one port) is less than -1.0dB past 50 GHz